Joy X-Ray

X-Ray inspection system X5600 Application 1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity. 2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components. 3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open. 4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement. 5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors. 6) Inner rupture or hollow inspection in plastic or metal. 7) Battery stacking uniformity, electrode welding inspection. 8) Seed, biological material inspection etc. 9) Inspection of internal cracks and Defects analysis of internal conditions Application Field 1.BGA 2.PCB/PCBA 3.Battery 4.LED 5.Semiconductor 6.Aluminum casting 7.wire 8.Others www.seamarkxray.com [email protected] whatsapp +8618779975930

• Mobile Phone, PDA, Tablet, Laptop, Desktop, Server repair • Consumer electronics, Set-top, TV, Game Console repair • Aerospace, Weapons, Avionics, Automotive, Transport electronics • Control and systems repair, R&D, assembly and repair rework • ZM -8586/852D 2 in 1 solder station, ZM-852D Hotair gun, ZM-938D soldering iron, DC power supply, Puyun 1102E digital oscilloscope, multi- Meter, programming device, adjustable reballing kit and so on.